TOSA/ROSA package
Product description
TOSA/ROSA package
small volume, low cost, high index.
TOSA/ROSA package usually uses the kovar metal ring frame gold tin brazing light window, high temperature brazing ceramic feed through component, metal heat dissipation bottom plate structure.This type of packaging package products have high integrated density, small volume and low cost, and can meet the 25Gbps transmission index. The supporting cover plate adopts the step cover structure to meet the parallel seam welding process.
The package feed-through component adopts the high-density HTCC multi-layer ceramic process, which effectively increases the lead density and air density reliability, and meets the miniaturization needs of the package module.
The heat dissipation bottom plate of the package generally adopts tungsten copper, molybdenum copper, CPC and other high heat dissipation materials, with the highest thermal conductivity of 260W/m.K.
The coating of the package can be adjusted according to the characteristics of the user's micro-assembly process, which can meet the welding process of lead and tin, gold and tin, gold and germanium and different atmospheric conditions.

Design drawings