Pump source laser package design usually uses metal ring frame directly fused seal glass feed joint, bonding or high temperature brazing anaerobic copper heat dissipation plate structure.Under the air tightness requirements, the ring frame and the heat dissipation bottom plate need to be soldered. This kind of packaging package products have relatively high requirements for package integrated brazing micro-deformation and gilding process control. Supporting large size cover plate adopts reinforced structure to meet the requirements of cover stress.