The package design usually adopts ceramic ring frame high temperature brazing kovar alloy metal sealing ring, metal heat dissipation bottom plate structure, shape structure, size and feed pipe foot number can be customized. This kind of packaging package product adopts a stable and reliable high-temperature brazing integration process, which can meet the requirements of rear channel micro-assembly and parallel seam welding process. The illustrated sample shows a 4-side 28pin power chip package structure with a sealing surface size of 15㎜ x 9㎜.