The package usually adopts metal ring frame high temperature brazing ceramic radio frequency, current feed assembly, metal heat dissipation plate structure. The overall structure, size and number of current load and RF feed pipe pins of this package product can be customized. The supporting cover plate adopts the flat cover structure to meet the parallel seam welding process. The illustrated sample shows a 6pin microwave power module package structure with a sealing surface size of 10㎜ x 7㎜.