ITLA butterfly package
Product description
ITLA butterfly package
available ceramic feed through and glass feed through structure.
Butterfly sealing package usually uses metal ring frame embedded in ceramic feed through assembly, brazed light pipe (light window), metal heat dissipation bottom plate, metal sealing ring structure.This type of package products can meet the requirements of air tightness and thermal insulation packaging through the complex cavity integrated with high precision mold. The supporting cover plate adopts the step cover structure to meet the parallel seam welding process.
The package feed-through component adopts HTCC high-temperature ceramic design structure, which effectively increases the lead density and air density reliability, and meets the miniaturization needs of the package module. Under special requirements, the glass melt seal feed through structure can also be used.
The heat dissipation plate of the package is generally made of tungsten copper, molybdenum copper material, with the highest thermal conductivity of 260W/m.K.
The coating of the package can be adjusted according to the characteristics of the user's micro-assembly process, which can meet the welding process of lead and tin, gold and tin, gold and germanium and different atmospheric conditions.

Design drawings